The iPhone 7, which should be officially presented next September, is probably already in production at the moment. In addition to this future smartphone, the design of the various components that will equip the iPhone 7S / 8 of 2017 has also already started. We are of course talking about the A11 processor here.
Indeed, according to information recently revealed by the site DigiTimes, TSMC and Apple are already developing the A11 processor for this future iPhone 8 / 7S. Unlike the previous model present on the iPhone 6S (engraved in 14 nm), this chip would be engraved in 10 nm. Besides, the founder would like to use his own technologies for engraving. We are talking in particular here about InFO technologies (Integrated Fan-Out) and WLP (Wafer-Level Packaging).
As a reminder, it could be that TSMC took care of the production of all of this component in 2017. This is quite normal since the apple company wants more than ever to be independent from its main competitor Samsung for the supply of the different elements that equip its devices. However, nothing is sure yet! Especially since the Seoul company always has the best technologies in terms of the design and production of various parts of smartphones such as processors or the famous OLED screens.